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Michael Mayer |
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Research Areas (Dec. 2011) ► Wire Bonding Microelectronic fine-wire bonding processes are used for almost all microchips and other microsystems. We try to better understand the physical mechanisms responsible for successful thermosonic ball and wedge bonding processes. Our work covers experimental, analytical, and numerical investigations. We use an unique microsensor real-time technology for our experimental work. The analysis of microsensor signals helps to understand mechanical and tribological aspects of the thermosonic bonding process. We are working on a comprehensive ultrasonic wire bonding theory. Many of our results have been obtained in collaboration with one or more of our partners: MK Electron Co. Ltd., Microbonds Inc., Kulicke and Soffa Industries (K&S), Intel, University of Seoul, Harbin Institute of Technology, Berlin Center of Advanced Packaging (BeCAP) at the Technical University Berlin. Cu and Pd coated Cu are to replace the commonly used but expensive Au microwires in more and more mass production applications. However, Cu wire can produce higher stresses during bonding increasing the risk of chip damage under the bonding sites (underpad damage), reducing production yield and equipment uptime to a degree that can offset the material cost savings. It is our goal to work towards reducing the risk of underpad damage, increasing Cu ball deformability, and finding low-stress bonding processes. ► Insulated Bonding
Wire Insulated bonding wire from Microbonds Inc. is a unique technology leading to more miniaturized microelectronics by enabling unpreceded versatility for interconnect and flexibility in design. Bond wire loops can be placed next to each other and even touch each other without electrical shorts. We demonstrate ways how to implement insulated wires in bonding processes. ► Microsensors,
Miniovens We design Microsensors to study bonding processes and also the quality of bonds during accelerated aging. For the sensors, we use CMOS technology. We also design miniaturized ovens to characterize wire bonds. These miniovens provide for electrical connection to the devices under test while in the oven and at high temperature.
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Page updated on Mar. 27, 2012
